Clean Transfer Robots
Wafer Transfer Robot [Atmospheric Environment]
UT-AFX/W4000 series
High payload model for wafers up to 300mm
Standard model which is available for high payload and extensive movement
Features
- Integrate servo-amp and adopt wiring-saving by HD-PLC technology
- High payload handling of Max 4kg including hand and hand folder
- Bernoulli's hand is going to chuck the back side part of the circumference on TAIKO-wafer
- Integrate servo-amp and adopt wiring-saving by HD-PLC technology
ACTRANS UT-AFX/W3000NM
For wafers up to 300mm Standard model
Standard model with power line communication technology
Features
- Standard model with power line communication technology
- Various options are available
UTX/W-RF5500RW
For wafers up to 300mm Water proof model
Water proof model
with protection class IP64
Features
- IP64 water/dust proof
- Wafer flip axis
UT-AXW3000NS series
For wafers up to 300mm
Vertically articulated SCARA arm robot that contributes to space saving in atmospheric transfer areas
Features
- Vertically articulated and 2-axis horizontal SCARA motion contributes to minimize transfer space in EFEM
- Wafer gripping method can be either vacuum chuck or pneumatic edge clamp.
- Built-in aligner type will be released
- Supports 3 to 5 ports with a wide range of vertical and horizontal access.
ACTRANS UTM-R3700F
For wafers up to 300mm
Features
- Wide operating range
- Small footprint
- High speed
Wafer Transfer Robot [Vacuum Environment]
UTVW-R2800H
For wafers up to 300mm, payload 2kg
Features
- A DD motor is adopted for the turning shaft, enabling high-precision operation
- With a 2 kg payload, it can also handle heavy loads
UT-VDX3000NS series
For wafers up to 300mm
High-precision vacuum robot for single arm type equipped with a direct drive motor to significantly reduce vibration
Features
- By installing a direct drive motor, vibration during arm operation is greatly reduced
- Supports ultra-high vacuum environment by vacuum seal of can type
- Contributes to improved equipment throughput with θ axis of endless type
- Built-in controller contributes to miniaturization of equipment
- With wafer center misalignment correction function
UT-VDW3000HS series
For wafers up to 300mm
High-speed, low vibration double-arm vacuum robot that achieves to a significant improvement in equipment throughput by 650wph of ultra high-speed.
Features
- Achieves 650WPH of ultra high-speed transfer in vacuum
- Equipped with direct drive motors to significantly reduce vibration during arm operation
- Improved trajectory accuracy and positioning accuracy by adopting a steel belt for the arm part
- Wafer slip prevention by adopting high friction pad for end effector
- With wafer center misalignment correction function
UT-VFX3000NM series
For wafers up to 300mm
Vacuum robot for single arm type that arm length and z stroke is selectable
Features
- Standard model prepares for two kinds of arm length
- Z-axis presence is selectable
- Available for various layouts of equipment
UT-VSW3000NS series
For wafers up to 300mm
Double-handled vacuum robot with SCARA arm that contributes to space saving in vacuum transfer area
Features
- Equipped with a SCARA arm, it is compatible with rectangular transfer modules, contributing to space saving.
- Double hand mounting for high speed wafer exchange.
- Equipped with a direct-drive motor for high-precision positioning and greatly reduced vibration during arm operation.
- Improved trajectory accuracy and positioning accuracy by using steel belts on the arms.
- Adoption of vacuum bulkhead seals instead of magnetic fluidic seals enables ultra-high vacuum and low outgassing.
